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| Type | Description |
|---|---|
| Series: | 110 |
| Package: | Bulk |
| Part Status: | Active |
| Type: | DIP, 0.6" (15.24mm) Row Spacing |
| Number of Positions or Pins (Grid): | 50 (2 x 25) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 29.5µin (0.75µm) |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Open Frame |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Tin |
| Contact Finish Thickness - Post: | - |
| Contact Material - Post: | Brass |
| Housing Material: | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
| Operating Temperature: | -55°C ~ 125°C |
| Image | Part Number | Description | Stock / Unit Price |
|---|---|---|---|
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CONN IC DIP SOCKET 32POS GOLD |
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40-C212-10Aries Electronics, Inc. |
CONN IC DIP SOCKET 40POS GOLD |
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08-0518-10Aries Electronics, Inc. |
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ICO-314-SGTSamtec, Inc. |
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ED068PLCZOn-Shore Technology, Inc. |
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8428-21B1-RK-TR3M |
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714-43-230-31-018000Mill-Max |
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In Stock: 0 $8.33000 |
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110-91-652-41-001000Mill-Max |
CONN IC DIP SOCKET 52POS GOLD |
In Stock: 0 $13.49464 |
