| Type | Description | 
|---|---|
| Series: | 907 | 
| Package: | Box | 
| Part Status: | Active | 
| Type: | Top Mount | 
| Package Cooled: | BGA | 
| Attachment Method: | Push Pin | 
| Shape: | Square, Pin Fins | 
| Length: | 1.299" (33.00mm) | 
| Width: | 1.299" (32.99mm) | 
| Diameter: | - | 
| Fin Height: | 0.693" (17.60mm) | 
| Power Dissipation @ Temperature Rise: | - | 
| Thermal Resistance @ Forced Air Flow: | 2.69°C/W @ 200 LFM | 
| Thermal Resistance @ Natural: | 10.50°C/W | 
| Material: | Aluminum | 
| Material Finish: | Black Anodized | 
| Image | Part Number | Description | Stock / Unit Price | 
|---|---|---|---|
|  | ATS-09D-05-C2-R0Advanced Thermal Solutions, Inc. | HEATSINK 40X40X25MM XCUT T766 | In Stock: 25 $6.19000 | 
|  | ATS-EXL76-1220-R0Advanced Thermal Solutions, Inc. | HEATSINK AL6063 1220X93.4X40MM | In Stock: 2 $189.61000 | 
|  | ATS-19H-64-C2-R0Advanced Thermal Solutions, Inc. | HEATSINK 40X40X25MM L-TAB T766 | In Stock: 25 $7.26000 | 
|  | 630-60ABWakefield-Vette | HEATSINK FOR BGA 35MM | In Stock: 0 $1.23796 | 
|  | ATS-12C-64-C2-R0Advanced Thermal Solutions, Inc. | HEATSINK 40X40X25MM L-TAB T766 | In Stock: 25 $7.26000 | 
|  | HSIB898-BGA-1iBASE Technology | AC, HEAT SPREADER FOR IB898, (RO | In Stock: 1 $26.94000 | 
|  | 39880100120Emerson Embedded Power (Artesyn Embedded Technologies) | HEATSINK 1/2 BRICK VERT | In Stock: 0 $7.71480 | 
|  | 658-25ABT5Wakefield-Vette | HEATSINK CPU 28MM SQ BLK W/TAPE | In Stock: 0 $1.60934 | 
|  | ATS-06D-184-C2-R0Advanced Thermal Solutions, Inc. | HEATSINK 40X40X25MM R-TAB T766 | In Stock: 25 $7.08000 | 
|  | 658-60ABT6Wakefield-Vette | HEATSINK EXTRUSION 27MM | In Stock: 0 $1.79868 |