| Type | Description | 
|---|---|
| Series: | 0503 | 
| Package: | Bulk | 
| Part Status: | Active | 
| Type: | SIP | 
| Number of Positions or Pins (Grid): | 16 (1 x 16) | 
| Pitch - Mating: | 0.100" (2.54mm) | 
| Contact Finish - Mating: | Gold | 
| Contact Finish Thickness - Mating: | 30.0µin (0.76µm) | 
| Contact Material - Mating: | Beryllium Copper | 
| Mounting Type: | Through Hole | 
| Features: | - | 
| Termination: | Wire Wrap | 
| Pitch - Post: | 0.100" (2.54mm) | 
| Contact Finish - Post: | Gold | 
| Contact Finish Thickness - Post: | 10.0µin (0.25µm) | 
| Contact Material - Post: | Brass | 
| Housing Material: | Polyamide (PA), Nylon, Glass Filled | 
| Operating Temperature: | - | 
| Image | Part Number | Description | Stock / Unit Price | 
|---|---|---|---|
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                                    02-4513-10Aries Electronics, Inc. | 
                                
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                                    44-6552-18Aries Electronics, Inc. | 
                                
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                                     CONN IC DIP SOCKET 28POS GOLD  | 
                                
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