Type | Description |
---|---|
Series: | 501 |
Package: | Bulk |
Part Status: | Active |
Type: | DIP, 0.3" (7.62mm) Row Spacing |
Number of Positions or Pins (Grid): | 20 (2 x 10) |
Pitch - Mating: | 0.100" (2.54mm) |
Contact Finish - Mating: | Tin |
Contact Finish Thickness - Mating: | 200.0µin (5.08µm) |
Contact Material - Mating: | Phosphor Bronze |
Mounting Type: | Through Hole |
Features: | Closed Frame |
Termination: | Wire Wrap |
Pitch - Post: | 0.100" (2.54mm) |
Contact Finish - Post: | Tin |
Contact Finish Thickness - Post: | 200.0µin (5.08µm) |
Contact Material - Post: | Phosphor Bronze |
Housing Material: | Polyamide (PA46), Nylon 4/6, Glass Filled |
Operating Temperature: | -55°C ~ 125°C |
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CONN IC DIP SOCKET ZIF 32POS TIN |
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36-3513-10Aries Electronics, Inc. |
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In Stock: 0 $19.56760 |
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