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| Type | Description |
|---|---|
| Series: | 55 |
| Package: | Bulk |
| Part Status: | Active |
| Type: | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing |
| Number of Positions or Pins (Grid): | 40 (2 x 20) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Nickel Boron |
| Contact Finish Thickness - Mating: | 50.0µin (1.27µm) |
| Contact Material - Mating: | Beryllium Nickel |
| Mounting Type: | Through Hole |
| Features: | Closed Frame |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Nickel Boron |
| Contact Finish Thickness - Post: | 50.0µin (1.27µm) |
| Contact Material - Post: | Beryllium Nickel |
| Housing Material: | Polyetheretherketone (PEEK), Glass Filled |
| Operating Temperature: | -55°C ~ 250°C |
| Image | Part Number | Description | Stock / Unit Price |
|---|---|---|---|
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522-93-100-13-061003Mill-Max |
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511-91-064-10-051003Mill-Max |
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CONN IC DIP SOCKET 40POS GOLD |
In Stock: 0 $1.70082 |
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614-93-100-13-062012Mill-Max |
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16-81250-10Aries Electronics, Inc. |
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In Stock: 0 $4.00400 |
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614-41-322-31-007000Mill-Max |
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612-91-624-41-001000Mill-Max |
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In Stock: 0 $14.88516 |
