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| Type | Description |
|---|---|
| Series: | 500 |
| Package: | Bulk |
| Part Status: | Active |
| Type: | DIP, 0.3" (7.62mm) Row Spacing |
| Number of Positions or Pins (Grid): | 20 (2 x 10) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Tin-Lead |
| Contact Finish Thickness - Mating: | - |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Closed Frame |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | - |
| Contact Finish Thickness - Post: | - |
| Contact Material - Post: | Brass |
| Housing Material: | - |
| Operating Temperature: | -55°C ~ 105°C |
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|---|---|---|---|
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CONN IC DIP SOCKET 20POS GOLD |
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CONN IC DIP SOCKET 6POS GOLD |
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CONN SOCKET SIP 15POS GOLD |
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CONN IC DIP SOCKET 24POS GOLD |
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CONN IC DIP SOCKET 18POS GOLD |
In Stock: 0 $0.00000 |
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CONN SOCKET SIP 23POS TIN |
In Stock: 0 $0.00000 |
