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| Type | Description |
|---|---|
| Series: | - |
| Package: | Bag |
| Part Status: | Active |
| Type: | Solder Paste |
| Composition: | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
| Diameter: | - |
| Melting Point: | - |
| Flux Type: | No-Clean, Water Soluble |
| Wire Gauge: | - |
| Process: | - |
| Form: | Jar, 1.76 oz (50g) |
| Shelf Life: | 12 Months |
| Shelf Life Start: | Date of Manufacture |
| Storage/Refrigeration Temperature: | 37°F ~ 42°F (3°C ~ 6°C) |
| Image | Part Number | Description | Stock / Unit Price |
|---|---|---|---|
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In Stock: 0 $52.30400 |
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TS391LT50Chip Quik, Inc. |
THERMALLY STABLE SOLDER PASTE NO |
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SMDSW.031 .7OZChip Quik, Inc. |
SOLDER WIRE POCKET PACK 63/37 TI |
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LF SOLDER WIRE 99.3/0.7 TIN/COPP |
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4890-18GMG Chemicals |
SOLDER RA 60/40 .032" POCKET PK |
In Stock: 48 $5.02000 |
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70-0202-0311Kester |
SOLDER PASTE NO CLEAN 600GM |
In Stock: 0 $140.16000 |
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92-9574-7619Kester |
SOLDER FLUX-CORED/275 .025" 500G |
In Stock: 0 $52.28800 |
