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| Type | Description |
|---|---|
| Series: | XR2 |
| Package: | Bulk |
| Part Status: | Active |
| Type: | DIP, 0.3" (7.62mm) Row Spacing |
| Number of Positions or Pins (Grid): | 14 (2 x 7) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 29.5µin (0.75µm) |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Open Frame |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Gold |
| Contact Finish Thickness - Post: | 29.5µin (0.75µm) |
| Contact Material - Post: | Beryllium Copper |
| Housing Material: | Polybutylene Terephthalate (PBT), Glass Filled |
| Operating Temperature: | -55°C ~ 125°C |
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|---|---|---|---|
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116-87-610-41-007101Preci-Dip |
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CONN IC DIP SOCKET 18POS GOLD |
In Stock: 0 $1.69041 |
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BU060Z-178-HTOn-Shore Technology, Inc. |
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110-47-950-41-001000Mill-Max |
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110-43-210-10-001000Mill-Max |
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110-41-328-41-001000Mill-Max |
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In Stock: 279 $2.15000 |
