Type | Description |
---|---|
Series: | 110 |
Package: | Tube |
Part Status: | Active |
Type: | DIP, 0.3" (7.62mm) Row Spacing |
Number of Positions or Pins (Grid): | 18 (2 x 9) |
Pitch - Mating: | 0.100" (2.54mm) |
Contact Finish - Mating: | Gold |
Contact Finish Thickness - Mating: | 30.0µin (0.76µm) |
Contact Material - Mating: | Beryllium Copper |
Mounting Type: | Through Hole |
Features: | Open Frame |
Termination: | Solder |
Pitch - Post: | 0.100" (2.54mm) |
Contact Finish - Post: | Tin-Lead |
Contact Finish Thickness - Post: | 200.0µin (5.08µm) |
Contact Material - Post: | Brass Alloy |
Housing Material: | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
Operating Temperature: | -55°C ~ 125°C |
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110-83-310-41-001101Preci-Dip |
CONN IC DIP SOCKET 10POS GOLD |
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10-3513-10Aries Electronics, Inc. |
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116-87-316-41-012101Preci-Dip |
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210-2599-00-06023M |
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299-99-210-12-001800Mill-Max |
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317-47-116-41-005000Mill-Max |
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