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714-43-230-31-018000

714-43-230-31-018000

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Manufacturer Part
714-43-230-31-018000
Manufacturer
Mill-Max
Description
CONN IC DIP SOCKET 30POS GOLD
Category
Connectors, Interconnects
Family
Sockets for ICs, Transistors
Series
-
InStock
1804
Datasheets Online
-
Inquiry

Product Specifications

Type Description
Series:714
Package:Bulk
Part Status:Active
Type:DIP, 0.1" (2.54mm) Row Spacing
Number of Positions or Pins (Grid):30 (2 x 15)
Pitch - Mating:0.100" (2.54mm)
Contact Finish - Mating:Gold
Contact Finish Thickness - Mating:30.0µin (0.76µm)
Contact Material - Mating:Beryllium Copper
Mounting Type:Through Hole
Features:Carrier, Closed Frame
Termination:Solder
Pitch - Post:0.100" (2.54mm)
Contact Finish - Post:Gold
Contact Finish Thickness - Post:30.0µin (0.76µm)
Contact Material - Post:Brass Alloy
Housing Material:Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Operating Temperature:-55°C ~ 125°C

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