Type | Description |
---|---|
Series: | Textool™ |
Package: | Bulk |
Part Status: | Active |
Type: | SOIC |
Number of Positions or Pins (Grid): | 24 (2 x 12) |
Pitch - Mating: | - |
Contact Finish - Mating: | Gold |
Contact Finish Thickness - Mating: | - |
Contact Material - Mating: | Beryllium Copper |
Mounting Type: | Through Hole |
Features: | Closed Frame |
Termination: | Solder |
Pitch - Post: | - |
Contact Finish - Post: | Gold |
Contact Finish Thickness - Post: | 30.0µin (0.76µm) |
Contact Material - Post: | Beryllium Copper |
Housing Material: | Polyethersulfone (PES), Glass Filled |
Operating Temperature: | -55°C ~ 150°C |
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