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| Type | Description |
|---|---|
| Series: | 116 |
| Package: | Bulk |
| Part Status: | Active |
| Type: | DIP, 0.6" (15.24mm) Row Spacing |
| Number of Positions or Pins (Grid): | 42 (2 x 21) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 29.5µin (0.75µm) |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Elevated, Open Frame |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Tin |
| Contact Finish Thickness - Post: | - |
| Contact Material - Post: | Brass |
| Housing Material: | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
| Operating Temperature: | -55°C ~ 125°C |
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|---|---|---|---|
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315-93-132-41-001000Mill-Max |
SOCKET LOW PROFILE SIP 32POS |
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ED084PLCZ-SM-NOn-Shore Technology, Inc. |
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210-47-640-41-001000Mill-Max |
CONN IC DIP SOCKET 40POS GOLD |
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115-43-624-41-001000Mill-Max |
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315-13-132-41-003000Mill-Max |
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BU240Z-178-HTOn-Shore Technology, Inc. |
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In Stock: 80 $2.96000 |
