Type | Description |
---|---|
Series: | 116 |
Package: | Bulk |
Part Status: | Active |
Type: | DIP, 0.6" (15.24mm) Row Spacing |
Number of Positions or Pins (Grid): | 52 (2 x 26) |
Pitch - Mating: | 0.100" (2.54mm) |
Contact Finish - Mating: | Gold |
Contact Finish Thickness - Mating: | 29.5µin (0.75µm) |
Contact Material - Mating: | Beryllium Copper |
Mounting Type: | Through Hole |
Features: | Elevated, Open Frame |
Termination: | Solder |
Pitch - Post: | 0.100" (2.54mm) |
Contact Finish - Post: | Tin |
Contact Finish Thickness - Post: | - |
Contact Material - Post: | Brass |
Housing Material: | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
Operating Temperature: | -55°C ~ 125°C |
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510-91-124-13-041001Mill-Max |
SOCKET SOLDERTAIL 124-PGA |
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117-87-656-41-105101Preci-Dip |
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210-43-316-41-001000Mill-Max |
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317-43-116-41-005000Mill-Max |
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116-83-420-41-009101Preci-Dip |
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28-6574-11Aries Electronics, Inc. |
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115-87-324-41-001101Preci-Dip |
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346-43-140-41-013000Mill-Max |
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