Type | Description |
---|---|
Series: | 116 |
Package: | Bulk |
Part Status: | Active |
Type: | DIP, 0.3" (7.62mm) Row Spacing |
Number of Positions or Pins (Grid): | 8 (2 x 4) |
Pitch - Mating: | 0.100" (2.54mm) |
Contact Finish - Mating: | Gold |
Contact Finish Thickness - Mating: | Flash |
Contact Material - Mating: | Beryllium Copper |
Mounting Type: | Through Hole |
Features: | Elevated, Open Frame |
Termination: | Solder |
Pitch - Post: | 0.100" (2.54mm) |
Contact Finish - Post: | Tin |
Contact Finish Thickness - Post: | - |
Contact Material - Post: | Brass |
Housing Material: | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
Operating Temperature: | -55°C ~ 125°C |
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714-43-254-31-018000Mill-Max |
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116-87-312-41-001101Preci-Dip |
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116-83-632-41-003101Preci-Dip |
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28-6823-90Aries Electronics, Inc. |
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210-43-314-41-001000Mill-Max |
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123-47-316-41-001000Mill-Max |
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116-87-316-41-001101Preci-Dip |
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210-93-320-41-001000Mill-Max |
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