Type | Description |
---|---|
Series: | - |
Package: | Bulk |
Part Status: | Active |
Type: | Transistor, TO-3 |
Number of Positions or Pins (Grid): | 3 (Round) |
Pitch - Mating: | - |
Contact Finish - Mating: | Tin-Lead |
Contact Finish Thickness - Mating: | 20.0µin (0.51µm) |
Contact Material - Mating: | Beryllium Copper |
Mounting Type: | Chassis Mount |
Features: | Closed Frame |
Termination: | Solder |
Pitch - Post: | - |
Contact Finish - Post: | Tin-Lead |
Contact Finish Thickness - Post: | 20.0µin (0.51µm) |
Contact Material - Post: | Beryllium Copper |
Housing Material: | Diallyl Phthalate (DAP) |
Operating Temperature: | -55°C ~ 125°C |
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