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| Type | Description |
|---|---|
| Series: | APR |
| Package: | Box |
| Part Status: | Obsolete |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Thermal Tape, Adhesive (Not Included) |
| Shape: | Square, Pin Fins |
| Length: | 1.657" (42.10mm) |
| Width: | 1.657" (42.10mm) |
| Diameter: | - |
| Fin Height: | 0.575" (14.60mm) |
| Power Dissipation @ Temperature Rise: | - |
| Thermal Resistance @ Forced Air Flow: | 2.00°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | - |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
| Image | Part Number | Description | Stock / Unit Price |
|---|---|---|---|
 |
411615B02500Comair Rotron |
HEATSINK EXTRUDED 25X41.6X38.1MM |
In Stock: 0 $0.00000 |
 |
7-345-3PP-BACTS Corporation |
HEATSINK PWR HORZ BLACK TO-220 |
In Stock: 0 $0.00000 |
 |
7-443-01E-BACTS Corporation |
HEATSINK PWR HORZ 1.0"H TO-3 |
In Stock: 0 $0.00000 |
 |
217-36CT6Wakefield-Vette |
HEATSINK DPAK SMT TIN PLATED |
In Stock: 0 $0.00000 |
 |
HS18Apex Microtechnology |
HEATSINK 12P DIP |
In Stock: 0 $0.00000 |
 |
ATS-PCB1028Advanced Thermal Solutions, Inc. |
HEATSINK CLIP-ON TO-220 BLACK |
In Stock: 0 $0.00000 |
 |
HS33Apex Microtechnology |
HEATSINK FOR DK AND HQ PACKAGES |
In Stock: 0 $0.00000 |
 |
HS03Apex Microtechnology |
HEATSINK 8P TO-3 1.7C/W |
In Stock: 0 $0.00000 |
 |
625-25ABT4Wakefield-Vette |
HEATSINK CPU 25MM SQ W/DBL TAPE |
In Stock: 0 $0.00000 |
 |
APR38-38-12CB/SCTS Corporation |
HEATSINK FORGED WITH SMALL CLIP |
In Stock: 0 $0.00000 |
