Type | Description |
---|---|
Series: | - |
Package: | Bulk |
Part Status: | Active |
Type: | LGA |
Number of Positions or Pins (Grid): | 2011 (47 x 58) |
Pitch - Mating: | 0.040" (1.02mm) |
Contact Finish - Mating: | Gold |
Contact Finish Thickness - Mating: | 15.0µin (0.38µm) |
Contact Material - Mating: | Copper Alloy |
Mounting Type: | Surface Mount |
Features: | Closed Frame |
Termination: | Solder |
Pitch - Post: | 0.035" (0.90mm) |
Contact Finish - Post: | Gold |
Contact Finish Thickness - Post: | 15.0µin (0.38µm) |
Contact Material - Post: | Copper Alloy |
Housing Material: | Thermoplastic |
Operating Temperature: | - |
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