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| Type | Description |
|---|---|
| Series: | pushPIN™ |
| Package: | Tray |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | - |
| Fin Height: | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | - |
| Thermal Resistance @ Forced Air Flow: | 9.39°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | - |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
| Image | Part Number | Description | Stock / Unit Price |
|---|---|---|---|
|
574102B03700GAavid |
BOARD LEVEL HEAT SINK |
In Stock: 0 $3.18534 |
|
901-19-2-28-2-B-0Wakefield-Vette |
HEAT SINK PIN FIN 19X19MM CLIP |
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ATS-10H-116-C2-R0Advanced Thermal Solutions, Inc. |
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In Stock: 25 $5.87000 |
|
HSET970-BiBASE Technology |
HEATSINK WITH COOLER FOR ET970 ( |
In Stock: 1 $38.72000 |
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ATS-03C-94-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM R-TAB T766 |
In Stock: 25 $7.26000 |
|
ATS-09F-94-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM R-TAB T766 |
In Stock: 25 $7.26000 |
|
ATS-X51300R-C1-R0Advanced Thermal Solutions, Inc. |
MAXIFLOW 29.25X29.25X19.5MM T766 |
In Stock: 100 $19.48000 |
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659-65ABT4EWakefield-Vette |
HEATSINK EXTRUSION 37MM |
In Stock: 0 $1.36592 |
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25MM HS ASSY PPA CLIP |
In Stock: 0 $20.12774 |
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132-11G9Wakefield-Vette |
HEATSINK EXTRUDED |
In Stock: 0 $54.11640 |
