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| Type | Description |
|---|---|
| Series: | pushPIN™ |
| Package: | Tray |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | - |
| Fin Height: | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | - |
| Thermal Resistance @ Forced Air Flow: | 9.39°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | - |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
| Image | Part Number | Description | Stock / Unit Price |
|---|---|---|---|
|
421AWakefield-Vette |
HEATSINK POWER TO-3 |
In Stock: 0 $13.01413 |
|
553003B00000Aavid |
BOARD LEVEL HEAT SINK |
In Stock: 0 $2.14938 |
|
IBR210 HEATSINKiBASE Technology |
HEATSINK;HSIBR210-B V-A |
In Stock: 0 $14.14000 |
|
530101B00100GAavid |
BOARD LEVEL HEAT SINK |
In Stock: 0 $2.29513 |
|
642-35ABT5Wakefield-Vette |
HEATSINK FOR 35MM BGA |
In Stock: 0 $1.39296 |
|
132-15.5GWakefield-Vette |
HEATSINK EXTRUDED |
In Stock: 0 $63.93680 |
|
ATS-21A-156-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM L-TAB T766 |
In Stock: 25 $7.08000 |
|
HSIB906-BGAiBASE Technology |
AC, HEATSINK FOR IB906F-1G, (ROH |
In Stock: 1 $38.72000 |
|
HSIB919-AiBASE Technology |
AC, HEATSINK FOR IB919 SERIES, ( |
In Stock: 1 $37.04000 |
|
D10850-40T3Wakefield-Vette |
HEATSINK 128PQFP COMPOSITE |
In Stock: 0 $3.04704 |
