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| Type | Description |
|---|---|
| Series: | pushPIN™ |
| Package: | Tray |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | - |
| Fin Height: | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | - |
| Thermal Resistance @ Forced Air Flow: | 4.14°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | - |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
| Image | Part Number | Description | Stock / Unit Price |
|---|---|---|---|
|
907-33-1-18-2-B-0Wakefield-Vette |
HEAT SINK ELLIP FIN 33X33MM CLIP |
In Stock: 0 $4.62728 |
|
ATS-09D-05-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM XCUT T766 |
In Stock: 25 $6.19000 |
|
ATS-EXL76-1220-R0Advanced Thermal Solutions, Inc. |
HEATSINK AL6063 1220X93.4X40MM |
In Stock: 2 $189.61000 |
|
ATS-19H-64-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM L-TAB T766 |
In Stock: 25 $7.26000 |
|
630-60ABWakefield-Vette |
HEATSINK FOR BGA 35MM |
In Stock: 0 $1.23796 |
|
ATS-12C-64-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM L-TAB T766 |
In Stock: 25 $7.26000 |
|
HSIB898-BGA-1iBASE Technology |
AC, HEAT SPREADER FOR IB898, (RO |
In Stock: 1 $26.94000 |
|
39880100120Emerson Embedded Power (Artesyn Embedded Technologies) |
HEATSINK 1/2 BRICK VERT |
In Stock: 0 $7.71480 |
|
658-25ABT5Wakefield-Vette |
HEATSINK CPU 28MM SQ BLK W/TAPE |
In Stock: 0 $1.60934 |
|
ATS-06D-184-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM R-TAB T766 |
In Stock: 25 $7.08000 |
