| Type | Description |
|---|---|
| Series: | NXG1 |
| Package: | Bulk |
| Part Status: | Active |
| Type: | Solder Paste |
| Composition: | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
| Diameter: | - |
| Melting Point: | 423 ~ 424°F (217 ~ 218°C) |
| Flux Type: | No-Clean |
| Wire Gauge: | - |
| Process: | Lead Free |
| Form: | Cartridge, 21.16 oz (600g) |
| Shelf Life: | 8 Months |
| Shelf Life Start: | Date of Manufacture |
| Storage/Refrigeration Temperature: | 32°F ~ 50°F (0°C ~ 10°C) |
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|---|---|---|---|
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