Type | Description |
---|---|
Series: | 508 |
Package: | Bulk |
Part Status: | Active |
Type: | SIP |
Number of Positions or Pins (Grid): | 21 (1 x 21) |
Pitch - Mating: | 0.100" (2.54mm) |
Contact Finish - Mating: | Gold |
Contact Finish Thickness - Mating: | 10.0µin (0.25µm) |
Contact Material - Mating: | Beryllium Copper |
Mounting Type: | Through Hole |
Features: | - |
Termination: | Wire Wrap |
Pitch - Post: | - |
Contact Finish - Post: | Tin |
Contact Finish Thickness - Post: | 200.0µin (5.08µm) |
Contact Material - Post: | Brass |
Housing Material: | Polyamide (PA46), Nylon 4/6 |
Operating Temperature: | -55°C ~ 105°C |
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