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| Type | Description |
|---|---|
| Series: | 518 |
| Package: | Bulk |
| Part Status: | Active |
| Type: | SIP |
| Number of Positions or Pins (Grid): | 35 (1 x 35) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 10.0µin (0.25µm) |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Open Frame |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Tin |
| Contact Finish Thickness - Post: | 200.0µin (5.08µm) |
| Contact Material - Post: | Brass |
| Housing Material: | Polyamide (PA46), Nylon 4/6, Glass Filled |
| Operating Temperature: | - |
| Image | Part Number | Description | Stock / Unit Price |
|---|---|---|---|
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523-93-064-10-051002Mill-Max |
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In Stock: 0 $39.63720 |
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13-0508-20Aries Electronics, Inc. |
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16-8285-310CAries Electronics, Inc. |
CONN IC DIP SOCKET 16POS GOLD |
In Stock: 0 $9.74583 |
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511-91-168-17-105001Mill-Max |
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210-91-322-41-001000Mill-Max |
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614-13-256-19-081001Mill-Max |
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257-PRS20013-12Aries Electronics, Inc. |
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