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| Type | Description |
|---|---|
| Series: | 558 |
| Package: | Bulk |
| Part Status: | Active |
| Type: | BGA |
| Number of Positions or Pins (Grid): | 480 (29 x 29) |
| Pitch - Mating: | 0.050" (1.27mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 10.0µin (0.25µm) |
| Contact Material - Mating: | Brass |
| Mounting Type: | Surface Mount |
| Features: | Closed Frame |
| Termination: | Solder |
| Pitch - Post: | 0.050" (1.27mm) |
| Contact Finish - Post: | Gold |
| Contact Finish Thickness - Post: | 10.0µin (0.25µm) |
| Contact Material - Post: | Brass |
| Housing Material: | FR4 Epoxy Glass |
| Operating Temperature: | -55°C ~ 125°C |
| Image | Part Number | Description | Stock / Unit Price |
|---|---|---|---|
|
511-93-088-13-062001Mill-Max |
SKT PGA SOLDRTL |
In Stock: 0 $26.75100 |
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612-43-316-41-003000Mill-Max |
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30-7365-10Aries Electronics, Inc. |
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In Stock: 0 $15.53250 |
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146-87-312-41-036101Preci-Dip |
CONN IC DIP SOCKET 12POS GOLD |
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511-13-049-07-000001Mill-Max |
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