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40-3552-16

40-3552-16

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Manufacturer Part
40-3552-16
Manufacturer
Aries Electronics, Inc.
Description
CONN IC DIP SOCKET ZIF 40POS
Category
Connectors, Interconnects
Family
Sockets for ICs, Transistors
Series
-
InStock
8298
Datasheets Online
-
Inquiry

Product Specifications

Type Description
Series:55
Package:Bulk
Part Status:Active
Type:DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid):40 (2 x 20)
Pitch - Mating:0.100" (2.54mm)
Contact Finish - Mating:Nickel Boron
Contact Finish Thickness - Mating:50.0µin (1.27µm)
Contact Material - Mating:Beryllium Copper
Mounting Type:Through Hole
Features:Closed Frame
Termination:Solder
Pitch - Post:0.100" (2.54mm)
Contact Finish - Post:Nickel Boron
Contact Finish Thickness - Post:50.0µin (1.27µm)
Contact Material - Post:Beryllium Copper
Housing Material:Polyphenylene Sulfide (PPS), Glass Filled
Operating Temperature:-

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