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| Type | Description |
|---|---|
| Series: | 558 |
| Package: | Bulk |
| Part Status: | Active |
| Type: | PGA |
| Number of Positions or Pins (Grid): | 356 (26 x 26) |
| Pitch - Mating: | 0.050" (1.27mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 10.0µin (0.25µm) |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Closed Frame |
| Termination: | Solder |
| Pitch - Post: | 0.050" (1.27mm) |
| Contact Finish - Post: | Gold |
| Contact Finish Thickness - Post: | 10.0µin (0.25µm) |
| Contact Material - Post: | Brass |
| Housing Material: | FR4 Epoxy Glass |
| Operating Temperature: | -55°C ~ 125°C |
| Image | Part Number | Description | Stock / Unit Price |
|---|---|---|---|
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110-99-428-61-001000Mill-Max |
CONN IC SKT DBL |
In Stock: 0 $19.46250 |
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64-9508-30Aries Electronics, Inc. |
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522-93-088-12-052002Mill-Max |
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111-93-650-61-001000Mill-Max |
CONN IC SKT DBL |
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14-8470-10WRAries Electronics, Inc. |
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510-87-156-15-061101Preci-Dip |
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614-87-084-10-001112Preci-Dip |
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In Stock: 0 $7.09471 |
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42-1518-10TAries Electronics, Inc. |
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In Stock: 0 $3.45406 |
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515-91-125-14-071001Mill-Max |
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In Stock: 0 $15.67660 |
