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510-93-089-12-051001

510-93-089-12-051001

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Manufacturer Part
510-93-089-12-051001
Manufacturer
Mill-Max
Description
SOCKET SOLDERTAIL 89-PGA
Category
Connectors, Interconnects
Family
Sockets for ICs, Transistors
Series
-
InStock
0383
Datasheets Online
-
Inquiry

Product Specifications

Type Description
Series:510
Package:Bulk
Part Status:Active
Type:PGA
Number of Positions or Pins (Grid):89 (12 x 12)
Pitch - Mating:0.100" (2.54mm)
Contact Finish - Mating:Gold
Contact Finish Thickness - Mating:30.0µin (0.76µm)
Contact Material - Mating:Beryllium Copper
Mounting Type:Through Hole
Features:Open Frame
Termination:Solder
Pitch - Post:0.100" (2.54mm)
Contact Finish - Post:-
Contact Finish Thickness - Post:-
Contact Material - Post:Brass Alloy
Housing Material:Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Operating Temperature:-55°C ~ 125°C

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