Type | Description |
---|---|
Series: | D95 |
Package: | Bulk |
Part Status: | Active |
Type: | DIP, 0.3" (7.62mm) Row Spacing |
Number of Positions or Pins (Grid): | 8 (2 x 4) |
Pitch - Mating: | 0.100" (2.54mm) |
Contact Finish - Mating: | Gold |
Contact Finish Thickness - Mating: | 29.5µin (0.75µm) |
Contact Material - Mating: | Beryllium Copper |
Mounting Type: | Through Hole |
Features: | Elevated, Open Frame |
Termination: | Solder |
Pitch - Post: | 0.100" (2.54mm) |
Contact Finish - Post: | Tin |
Contact Finish Thickness - Post: | 196.9µin (5.00µm) |
Contact Material - Post: | Brass |
Housing Material: | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled |
Operating Temperature: | -55°C ~ 125°C |
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515-91-181-14-031003Mill-Max |
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28-3508-30Aries Electronics, Inc. |
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511-93-155-18-121003Mill-Max |
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117-43-656-41-105000Mill-Max |
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14-820-90TWRAries Electronics, Inc. |
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