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514-83-456M26-001148

514-83-456M26-001148

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Manufacturer Part
514-83-456M26-001148
Manufacturer
Preci-Dip
Description
CONN SOCKET BGA 456POS GOLD
Category
Connectors, Interconnects
Family
Sockets for ICs, Transistors
Series
-
InStock
3789
Datasheets Online
-
Inquiry

Product Specifications

Type Description
Series:514
Package:Bulk
Part Status:Active
Type:BGA
Number of Positions or Pins (Grid):456 (26 x 26)
Pitch - Mating:0.100" (2.54mm)
Contact Finish - Mating:Gold
Contact Finish Thickness - Mating:29.5µin (0.75µm)
Contact Material - Mating:Beryllium Copper
Mounting Type:Surface Mount
Features:Open Frame
Termination:Solder
Pitch - Post:0.100" (2.54mm)
Contact Finish - Post:Tin
Contact Finish Thickness - Post:-
Contact Material - Post:Brass
Housing Material:Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature:-55°C ~ 125°C

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