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18-1518-00

18-1518-00

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Manufacturer Part
18-1518-00
Manufacturer
Aries Electronics, Inc.
Description
CONN IC DIP SOCKET 18POS GOLD
Category
Connectors, Interconnects
Family
Sockets for ICs, Transistors
Series
-
InStock
4547
Datasheets Online
-
Inquiry

Product Specifications

Type Description
Series:518
Package:Bulk
Part Status:Active
Type:DIP, 0.2" (5.08mm) Row Spacing
Number of Positions or Pins (Grid):18 (2 x 9)
Pitch - Mating:0.100" (2.54mm)
Contact Finish - Mating:Gold
Contact Finish Thickness - Mating:10.0µin (0.25µm)
Contact Material - Mating:Beryllium Copper
Mounting Type:Through Hole
Features:Open Frame
Termination:Solder
Pitch - Post:0.100" (2.54mm)
Contact Finish - Post:Tin
Contact Finish Thickness - Post:200.0µin (5.08µm)
Contact Material - Post:Brass
Housing Material:Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature:-

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