Type | Description |
---|---|
Series: | PGM |
Package: | Bulk |
Part Status: | Active |
Type: | PGA |
Number of Positions or Pins (Grid): | - |
Pitch - Mating: | 0.100" (2.54mm) |
Contact Finish - Mating: | Gold |
Contact Finish Thickness - Mating: | 10.0µin (0.25µm) |
Contact Material - Mating: | Beryllium Copper |
Mounting Type: | Through Hole |
Features: | - |
Termination: | Solder |
Pitch - Post: | 0.100" (2.54mm) |
Contact Finish - Post: | Gold |
Contact Finish Thickness - Post: | 10.0µin (0.25µm) |
Contact Material - Post: | Brass |
Housing Material: | Polyamide (PA46), Nylon 4/6, Glass Filled |
Operating Temperature: | -55°C ~ 125°C |
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115-93-964-41-001000Mill-Max |
CONN IC DIP SOCKET 64POS GOLD |
In Stock: 0 $16.07556 |
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110-11-950-41-001000Mill-Max |
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515-91-225-15-000003Mill-Max |
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126-41-314-41-002000Mill-Max |
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27-0508-31Aries Electronics, Inc. |
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In Stock: 0 $17.85000 |
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551-90-121-13-061004Mill-Max |
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