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ICA-632-SGG

ICA-632-SGG

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Manufacturer Part
ICA-632-SGG
Manufacturer
Samtec, Inc.
Description
CONN IC DIP SOCKET 32POS GOLD
Category
Connectors, Interconnects
Family
Sockets for ICs, Transistors
Series
-
InStock
4864
Datasheets Online
-
Inquiry

Product Specifications

Type Description
Series:ICA
Package:Tube
Part Status:Active
Type:DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid):32 (2 x 16)
Pitch - Mating:0.100" (2.54mm)
Contact Finish - Mating:Gold
Contact Finish Thickness - Mating:10.0µin (0.25µm)
Contact Material - Mating:Beryllium Copper
Mounting Type:Through Hole
Features:Open Frame
Termination:Solder
Pitch - Post:0.100" (2.54mm)
Contact Finish - Post:Tin
Contact Finish Thickness - Post:10.0µin (0.25µm)
Contact Material - Post:Beryllium Copper
Housing Material:Polyester
Operating Temperature:-55°C ~ 125°C

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