Type | Description |
---|---|
Series: | 550 |
Package: | Bulk |
Part Status: | Active |
Type: | BGA |
Number of Positions or Pins (Grid): | 256 (16 x 16) |
Pitch - Mating: | 0.100" (2.54mm) |
Contact Finish - Mating: | Gold |
Contact Finish Thickness - Mating: | 10.0µin (0.25µm) |
Contact Material - Mating: | Beryllium Copper |
Mounting Type: | Through Hole |
Features: | Closed Frame |
Termination: | Solder |
Pitch - Post: | 0.100" (2.54mm) |
Contact Finish - Post: | Gold |
Contact Finish Thickness - Post: | 10.0µin (0.25µm) |
Contact Material - Post: | Brass |
Housing Material: | FR4 Epoxy Glass |
Operating Temperature: | -55°C ~ 125°C |
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