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| Type | Description |
|---|---|
| Series: | 501 |
| Package: | Bulk |
| Part Status: | Active |
| Type: | SIP |
| Number of Positions or Pins (Grid): | 14 (1 x 14) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Tin |
| Contact Finish Thickness - Mating: | 200.0µin (5.08µm) |
| Contact Material - Mating: | Phosphor Bronze |
| Mounting Type: | Through Hole |
| Features: | - |
| Termination: | Wire Wrap |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Tin |
| Contact Finish Thickness - Post: | 200.0µin (5.08µm) |
| Contact Material - Post: | Phosphor Bronze |
| Housing Material: | Polyamide (PA46), Nylon 4/6, Glass Filled |
| Operating Temperature: | -55°C ~ 105°C |
| Image | Part Number | Description | Stock / Unit Price |
|---|---|---|---|
|
08-3513-10HAries Electronics, Inc. |
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27-7580-10Aries Electronics, Inc. |
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06-810-90CAries Electronics, Inc. |
CONN IC DIP SOCKET 6POS GOLD |
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614-13-088-12-052001Mill-Max |
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32-6501-21Aries Electronics, Inc. |
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In Stock: 0 $13.80000 |
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551-90-065-10-051005Mill-Max |
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210-41-320-41-001000Mill-Max |
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