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550-10-352M26-001152

550-10-352M26-001152

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Manufacturer Part
550-10-352M26-001152
Manufacturer
Preci-Dip
Description
BGA SOLDER TAIL
Category
Connectors, Interconnects
Family
Sockets for ICs, Transistors
Series
-
InStock
7818
Datasheets Online
-
Inquiry

Product Specifications

Type Description
Series:550
Package:Bulk
Part Status:Active
Type:BGA
Number of Positions or Pins (Grid):352 (26 x 26)
Pitch - Mating:0.050" (1.27mm)
Contact Finish - Mating:Gold
Contact Finish Thickness - Mating:10.0µin (0.25µm)
Contact Material - Mating:Brass
Mounting Type:Through Hole
Features:Closed Frame
Termination:Solder
Pitch - Post:0.050" (1.27mm)
Contact Finish - Post:Gold
Contact Finish Thickness - Post:10.0µin (0.25µm)
Contact Material - Post:Brass
Housing Material:FR4 Epoxy Glass
Operating Temperature:-55°C ~ 125°C

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