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| Type | Description |
|---|---|
| Series: | 558 |
| Package: | Bulk |
| Part Status: | Active |
| Type: | PGA |
| Number of Positions or Pins (Grid): | 192 (16 x 16) |
| Pitch - Mating: | 0.050" (1.27mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 10.0µin (0.25µm) |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Closed Frame |
| Termination: | Solder |
| Pitch - Post: | 0.050" (1.27mm) |
| Contact Finish - Post: | Gold |
| Contact Finish Thickness - Post: | 10.0µin (0.25µm) |
| Contact Material - Post: | Brass |
| Housing Material: | FR4 Epoxy Glass |
| Operating Temperature: | -55°C ~ 125°C |
| Image | Part Number | Description | Stock / Unit Price |
|---|---|---|---|
|
110-44-636-41-001000Mill-Max |
CONN IC SKT DBL |
In Stock: 0 $12.82855 |
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614-13-088-13-062007Mill-Max |
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In Stock: 0 $18.84000 |
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18-8590-610CAries Electronics, Inc. |
CONN IC DIP SOCKET 18POS GOLD |
In Stock: 0 $10.26000 |
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551-90-056-09-041004Mill-Max |
CONN HDR SOLDRTL |
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511-93-072-11-061003Mill-Max |
SKT PGA SOLDRTL |
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515-91-069-11-061001Mill-Max |
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In Stock: 0 $14.55200 |
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110-43-424-41-105000Mill-Max |
CONN IC SKT DBL |
In Stock: 0 $13.58641 |
