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30-6823-90

30-6823-90

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Manufacturer Part
30-6823-90
Manufacturer
Aries Electronics, Inc.
Description
CONN IC DIP SOCKET 30POS GOLD
Category
Connectors, Interconnects
Family
Sockets for ICs, Transistors
Series
-
InStock
8636
Datasheets Online
-
Inquiry

Product Specifications

Type Description
Series:Vertisockets™ 800
Package:Bulk
Part Status:Active
Type:DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid):30 (2 x 15)
Pitch - Mating:0.100" (2.54mm)
Contact Finish - Mating:Gold
Contact Finish Thickness - Mating:10.0µin (0.25µm)
Contact Material - Mating:Phosphor Bronze
Mounting Type:Through Hole, Right Angle, Horizontal
Features:Closed Frame
Termination:Solder
Pitch - Post:0.100" (2.54mm)
Contact Finish - Post:Gold
Contact Finish Thickness - Post:10.0µin (0.25µm)
Contact Material - Post:Phosphor Bronze
Housing Material:Polyamide (PA46), Nylon 4/6
Operating Temperature:-

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