Type | Description |
---|---|
Series: | 6556 |
Package: | Bulk |
Part Status: | Active |
Type: | DIP, 0.6" (15.24mm) Row Spacing |
Number of Positions or Pins (Grid): | 28 (2 x 14) |
Pitch - Mating: | 0.100" (2.54mm) |
Contact Finish - Mating: | Gold |
Contact Finish Thickness - Mating: | 30.0µin (0.76µm) |
Contact Material - Mating: | Beryllium Copper |
Mounting Type: | Through Hole |
Features: | Open Frame |
Termination: | Solder Cup |
Pitch - Post: | 0.100" (2.54mm) |
Contact Finish - Post: | Gold |
Contact Finish Thickness - Post: | 10.0µin (0.25µm) |
Contact Material - Post: | Brass |
Housing Material: | Polyphenylene Sulfide (PPS), Glass Filled |
Operating Temperature: | - |
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510-91-324-18-000003Mill-Max |
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614-93-124-13-041007Mill-Max |
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40-6513-11HAries Electronics, Inc. |
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40-3503-20Aries Electronics, Inc. |
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40-3503-31Aries Electronics, Inc. |
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In Stock: 0 $24.14250 |
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510-93-238-19-086002Mill-Max |
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126-93-422-41-002000Mill-Max |
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