Type | Description |
---|---|
Series: | 614 |
Package: | Bulk |
Part Status: | Active |
Type: | PGA |
Number of Positions or Pins (Grid): | 69 (11 x 11) |
Pitch - Mating: | 0.100" (2.54mm) |
Contact Finish - Mating: | Gold |
Contact Finish Thickness - Mating: | 29.5µin (0.75µm) |
Contact Material - Mating: | Beryllium Copper |
Mounting Type: | Through Hole |
Features: | Carrier, Open Frame |
Termination: | Solder |
Pitch - Post: | 0.100" (2.54mm) |
Contact Finish - Post: | Tin |
Contact Finish Thickness - Post: | - |
Contact Material - Post: | Brass |
Housing Material: | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
Operating Temperature: | -55°C ~ 125°C |
Image | Part Number | Description | Stock / Unit Price |
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40-C300-20Aries Electronics, Inc. |
CONN IC DIP SOCKET 40POS GOLD |
In Stock: 0 $22.53400 |
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20-7625-10Aries Electronics, Inc. |
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17-0508-30Aries Electronics, Inc. |
CONN SOCKET SIP 17POS GOLD |
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612-43-310-41-004000Mill-Max |
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In Stock: 0 $13.38925 |
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510-93-072-11-061001Mill-Max |
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558-10-400M20-000101Preci-Dip |
PGA SOLDER TAIL 1.27MM |
In Stock: 0 $38.07323 |
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116-41-306-41-007000Mill-Max |
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In Stock: 0 $12.19313 |
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511-13-108-12-051003Mill-Max |
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30-6513-11Aries Electronics, Inc. |
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