Type | Description |
---|---|
Series: | - |
Package: | Bulk |
Part Status: | Active |
Type: | Zig-Zag |
Number of Positions or Pins (Grid): | 39 (1 x 19, 1 x 20) |
Pitch - Mating: | 0.100" (2.54mm) |
Contact Finish - Mating: | Gold |
Contact Finish Thickness - Mating: | 30.0µin (0.76µm) |
Contact Material - Mating: | Beryllium Copper |
Mounting Type: | Through Hole |
Features: | Closed Frame |
Termination: | Solder |
Pitch - Post: | 0.100" (2.54mm) |
Contact Finish - Post: | Gold |
Contact Finish Thickness - Post: | 30.0µin (0.76µm) |
Contact Material - Post: | Beryllium Copper |
Housing Material: | Polysulfone (PSU), Glass Filled |
Operating Temperature: | -55°C ~ 150°C |
Image | Part Number | Description | Stock / Unit Price |
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36-6573-16Aries Electronics, Inc. |
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510-93-175-16-006001Mill-Max |
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612-43-422-41-001000Mill-Max |
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