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| Type | Description |
|---|---|
| Series: | 55 |
| Package: | Bulk |
| Part Status: | Active |
| Type: | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing |
| Number of Positions or Pins (Grid): | 32 (2 x 16) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Nickel Boron |
| Contact Finish Thickness - Mating: | 50.0µin (1.27µm) |
| Contact Material - Mating: | Beryllium Nickel |
| Mounting Type: | Through Hole |
| Features: | Closed Frame |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Nickel Boron |
| Contact Finish Thickness - Post: | 50.0µin (1.27µm) |
| Contact Material - Post: | Beryllium Nickel |
| Housing Material: | Polyetheretherketone (PEEK), Glass Filled |
| Operating Temperature: | -55°C ~ 250°C |
| Image | Part Number | Description | Stock / Unit Price |
|---|---|---|---|
|
523-13-225-15-000003Mill-Max |
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510-93-025-05-000003Mill-Max |
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25-7XXXX-10Aries Electronics, Inc. |
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18-3503-20Aries Electronics, Inc. |
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22-4508-31Aries Electronics, Inc. |
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522-13-179-18-095003Mill-Max |
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In Stock: 0 $62.21660 |
