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| Type | Description |
|---|---|
| Series: | 508 |
| Package: | Bulk |
| Part Status: | Active |
| Type: | DIP, 0.3" (7.62mm) Row Spacing |
| Number of Positions or Pins (Grid): | 18 (2 x 9) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 30.0µin (0.76µm) |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Open Frame |
| Termination: | Wire Wrap |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Gold |
| Contact Finish Thickness - Post: | 10.0µin (0.25µm) |
| Contact Material - Post: | Brass |
| Housing Material: | Polyamide (PA46), Nylon 4/6, Glass Filled |
| Operating Temperature: | -55°C ~ 125°C |
| Image | Part Number | Description | Stock / Unit Price |
|---|---|---|---|
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510-13-012-05-001001Mill-Max |
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In Stock: 0 $19.82700 |
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515-91-089-13-061001Mill-Max |
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605-43-420-11-480000Mill-Max |
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03-0503-30Aries Electronics, Inc. |
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