Type | Description |
---|---|
Series: | PRS |
Package: | Bulk |
Part Status: | Active |
Type: | PGA, ZIF (ZIP) |
Number of Positions or Pins (Grid): | - |
Pitch - Mating: | 0.100" (2.54mm) |
Contact Finish - Mating: | Gold |
Contact Finish Thickness - Mating: | 30.0µin (0.76µm) |
Contact Material - Mating: | Beryllium Copper |
Mounting Type: | Through Hole |
Features: | Closed Frame |
Termination: | Solder |
Pitch - Post: | 0.100" (2.54mm) |
Contact Finish - Post: | Tin |
Contact Finish Thickness - Post: | 200.0µin (5.08µm) |
Contact Material - Post: | Beryllium Copper |
Housing Material: | Polyphenylene Sulfide (PPS) |
Operating Temperature: | -65°C ~ 125°C |
Image | Part Number | Description | Stock / Unit Price |
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18-1518-10HAries Electronics, Inc. |
CONN IC DIP SOCKET 18POS GOLD |
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32-6518-10HAries Electronics, Inc. |
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