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DIP316-001BLF

DIP316-001BLF

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Manufacturer Part
DIP316-001BLF
Manufacturer
Storage & Server IO (Amphenol ICC)
Description
CONN IC DIP SOCKET 16POS GOLD
Category
Connectors, Interconnects
Family
Sockets for ICs, Transistors
Series
-
InStock
3041
Datasheets Online
-
Inquiry

Product Specifications

Type Description
Series:-
Package:Tube
Part Status:Obsolete
Type:DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid):16 (2 x 8)
Pitch - Mating:0.100" (2.54mm)
Contact Finish - Mating:Gold
Contact Finish Thickness - Mating:30.0µin (0.76µm)
Contact Material - Mating:Beryllium Copper
Mounting Type:Through Hole
Features:Open Frame
Termination:Solder
Pitch - Post:0.100" (2.54mm)
Contact Finish - Post:Tin
Contact Finish Thickness - Post:200.0µin (5.08µm)
Contact Material - Post:Brass
Housing Material:Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature:-

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