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| Type | Description |
|---|---|
| Series: | 123 |
| Package: | Tube |
| Part Status: | Obsolete |
| Type: | DIP, 0.4" (10.16mm) Row Spacing |
| Number of Positions or Pins (Grid): | 22 (2 x 11) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 30.0µin (0.76µm) |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Open Frame, Decoupling Capacitor |
| Termination: | Wire Wrap |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Tin-Lead |
| Contact Finish Thickness - Post: | 200.0µin (5.08µm) |
| Contact Material - Post: | Brass Alloy |
| Housing Material: | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
| Operating Temperature: | -55°C ~ 125°C |
| Image | Part Number | Description | Stock / Unit Price |
|---|---|---|---|
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CONN IC DIP SOCKET 28POS GOLD |
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CONN IC DIP SOCKET 20POS GOLD |
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0784990002Woodhead - Molex |
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289-PLS17001-16Aries Electronics, Inc. |
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In Stock: 0 $0.00000 |
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SIP050-1X31-160BLFStorage & Server IO (Amphenol ICC) |
CONN SOCKET SIP 31POS GOLD |
In Stock: 0 $0.00000 |
