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| Type | Description |
|---|---|
| Series: | - |
| Package: | Bulk |
| Part Status: | Obsolete |
| Type: | PGA |
| Number of Positions or Pins (Grid): | 168 (17 x 17) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 30.0µin (0.76µm) |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Open Frame |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Tin-Lead |
| Contact Finish Thickness - Post: | 30.0µin (0.76µm) |
| Contact Material - Post: | Brass |
| Housing Material: | Thermoplastic, Polyester |
| Operating Temperature: | - |
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|---|---|---|---|
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0475960233Woodhead - Molex |
CONN SOCKET LGA 1155POS GOLD |
In Stock: 0 $0.00000 |
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CONN IC DIP SOCKET 32POS GOLD |
In Stock: 0 $0.00000 |
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In Stock: 0 $0.00000 |
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CONN IC DIP SOCKET 36POS GOLD |
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