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| Type | Description |
|---|---|
| Series: | 115 |
| Package: | Tube |
| Part Status: | Active |
| Type: | DIP, 0.3" (7.62mm) Row Spacing |
| Number of Positions or Pins (Grid): | 28 (2 x 14) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | Flash |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Open Frame |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Tin |
| Contact Finish Thickness - Post: | 200.0µin (5.08µm) |
| Contact Material - Post: | Brass Alloy |
| Housing Material: | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
| Operating Temperature: | -55°C ~ 125°C |
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|---|---|---|---|
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CONN IC DIP SOCKET 18POS GOLD |
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10-3513-10Aries Electronics, Inc. |
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317-47-116-41-005000Mill-Max |
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BU320ZOn-Shore Technology, Inc. |
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In Stock: 0 $1.39000 |
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117-87-764-41-005101Preci-Dip |
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In Stock: 827 $3.36000 |
