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| Type | Description |
|---|---|
| Series: | 8 |
| Package: | Bulk |
| Part Status: | Active |
| Type: | DIP, 0.6" (15.24mm) Row Spacing |
| Number of Positions or Pins (Grid): | 18 (2 x 9) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 30.0µin (0.76µm) |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Closed Frame, Elevated |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Gold |
| Contact Finish Thickness - Post: | 10.0µin (0.25µm) |
| Contact Material - Post: | Brass |
| Housing Material: | Polyamide (PA46), Nylon 4/6, Glass Filled |
| Operating Temperature: | -55°C ~ 105°C |
| Image | Part Number | Description | Stock / Unit Price |
|---|---|---|---|
|
D95008-42Harwin |
CONN IC DIP SOCKET 8POS GOLD |
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28-3508-30Aries Electronics, Inc. |
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511-93-155-18-121003Mill-Max |
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110-93-642-61-001000Mill-Max |
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522-13-076-11-041002Mill-Max |
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117-43-656-41-105000Mill-Max |
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In Stock: 0 $18.24900 |
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14-820-90TWRAries Electronics, Inc. |
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In Stock: 0 $7.72800 |
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223-33-318-41-101000Mill-Max |
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In Stock: 0 $67.68303 |
