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528-AG11D-ESL

528-AG11D-ESL

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Manufacturer Part
528-AG11D-ESL
Manufacturer
TE Connectivity AMP Connectors
Description
CONN IC DIP SOCKET 28POS GOLD
Category
Connectors, Interconnects
Family
Sockets for ICs, Transistors
Series
-
InStock
4863
Datasheets Online
-
Inquiry

Product Specifications

Type Description
Series:500
Package:Bulk
Part Status:Active
Type:DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid):28 (2 x 14)
Pitch - Mating:0.100" (2.54mm)
Contact Finish - Mating:Gold
Contact Finish Thickness - Mating:5.00µin (0.127µm)
Contact Material - Mating:Beryllium Copper
Mounting Type:Through Hole
Features:Closed Frame
Termination:Solder
Pitch - Post:0.100" (2.54mm)
Contact Finish - Post:Tin-Lead
Contact Finish Thickness - Post:5.00µin (0.127µm)
Contact Material - Post:Brass, Copper
Housing Material:Polyester
Operating Temperature:-55°C ~ 125°C

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