Type | Description |
---|---|
Series: | 501 |
Package: | Bulk |
Part Status: | Active |
Type: | SIP |
Number of Positions or Pins (Grid): | 31 (1 x 31) |
Pitch - Mating: | 0.100" (2.54mm) |
Contact Finish - Mating: | Gold |
Contact Finish Thickness - Mating: | 10.0µin (0.25µm) |
Contact Material - Mating: | Phosphor Bronze |
Mounting Type: | Through Hole |
Features: | - |
Termination: | Wire Wrap |
Pitch - Post: | 0.100" (2.54mm) |
Contact Finish - Post: | Gold |
Contact Finish Thickness - Post: | 10.0µin (0.25µm) |
Contact Material - Post: | Phosphor Bronze |
Housing Material: | Polyamide (PA46), Nylon 4/6, Glass Filled |
Operating Temperature: | -55°C ~ 125°C |
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16-3501-30Aries Electronics, Inc. |
CONN IC DIP SOCKET 16POS TIN |
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24-6556-10Aries Electronics, Inc. |
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110-91-950-41-105000Mill-Max |
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10-0513-10TAries Electronics, Inc. |
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14-3513-10TAries Electronics, Inc. |
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